Warpage simulation and experimental verification for 320mm×320mm panel level fan-out packaging based on die-first process
文献类型：期刊论文
| 作者 | Chen F(陈峰); Su MY(苏梅英); Cao LQ(曹立强); Tingyu Lin; Li J(李君); Chen C(陈诚); Tian GX(田更新) |
| 刊名 | Microelectronics Reliability
 |
| 出版日期 | 2018-03-20 |
| 文献子类 | 期刊论文 |
| 源URL | [http://159.226.55.107/handle/172511/19055]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Chen F,Su MY,Cao LQ,et al. Warpage simulation and experimental verification for 320mm×320mm panel level fan-out packaging based on die-first process[J]. Microelectronics Reliability,2018. |
| APA | 陈峰.,苏梅英.,曹立强.,Tingyu Lin.,李君.,...&田更新.(2018).Warpage simulation and experimental verification for 320mm×320mm panel level fan-out packaging based on die-first process.Microelectronics Reliability. |
| MLA | 陈峰,et al."Warpage simulation and experimental verification for 320mm×320mm panel level fan-out packaging based on die-first process".Microelectronics Reliability (2018). |
入库方式： OAI收割
来源：微电子研究所
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