Evaluation of PMMA Residues as a Function of Baking Temperature and a Graphene Heat-Free-Transfer Process to Reduce Them
文献类型:期刊论文
作者 | Jia KP(贾昆鹏)![]() ![]() ![]() ![]() ![]() ![]() ![]() |
刊名 | ECS Journal of Solid state science and tehchnology
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出版日期 | 2016 |
文献子类 | 期刊论文 |
英文摘要 | For the fabrication of high performance graphene devices, the transfer process with clean surface without too many PMMA residues is of paramount importance in that it is has great impact on graphene interface. In this paper, a graphene heat-free-transfer process is proposed for the first time in order to get a decently clean surface. The evaluation of PMMA residues as a function of baking temperature is carried out. |
源URL | [http://159.226.55.106/handle/172511/16197] ![]() |
专题 | 微电子研究所_集成电路先导工艺研发中心 |
作者单位 | 中国科学院微电子研究所 |
推荐引用方式 GB/T 7714 | Jia KP,Luo J,Hu RY,et al. Evaluation of PMMA Residues as a Function of Baking Temperature and a Graphene Heat-Free-Transfer Process to Reduce Them[J]. ECS Journal of Solid state science and tehchnology,2016. |
APA | Jia KP.,Luo J.,Hu RY.,Zhan J.,Cao HS.,...&Chen DP.(2016).Evaluation of PMMA Residues as a Function of Baking Temperature and a Graphene Heat-Free-Transfer Process to Reduce Them.ECS Journal of Solid state science and tehchnology. |
MLA | Jia KP,et al."Evaluation of PMMA Residues as a Function of Baking Temperature and a Graphene Heat-Free-Transfer Process to Reduce Them".ECS Journal of Solid state science and tehchnology (2016). |
入库方式: OAI收割
来源:微电子研究所
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