a-SiCx : H films deposited by plasma-enhanced chemical vapor deposition at low temperature used for moisture and corrosion resistant applications
文献类型:期刊论文
作者 | Jiang, LJ ; Chen, X ; Wang, XH ; Xu, LQ ; Stubhan, F ; Merkel, KH |
刊名 | THIN SOLID FILMS
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出版日期 | 1999-01-01 |
卷号 | 352期号:1-2页码:97-101 |
关键词 | SILICON CARBIDE FILMS FREQUENCY LAYERS ALLOY PECVD |
ISSN号 | 0040-6090 |
通讯作者 | Xu, LQ, Acad Sinica, Shanghai Inst Met, SIM DaimlerChrysler Lab, Shanghai 200050, Peoples R China |
学科主题 | Materials Science, Multidisciplinary; Materials Science, Coatings & Films; Physics, Applied; Physics, Condensed Matter |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2011-11-09 |
源URL | [http://ir.sim.ac.cn/handle/331004/17483] ![]() |
专题 | 上海微系统与信息技术研究所_化学研究_期刊论文 |
推荐引用方式 GB/T 7714 | Jiang, LJ,Chen, X,Wang, XH,et al. a-SiCx : H films deposited by plasma-enhanced chemical vapor deposition at low temperature used for moisture and corrosion resistant applications[J]. THIN SOLID FILMS,1999,352(1-2):97-101. |
APA | Jiang, LJ,Chen, X,Wang, XH,Xu, LQ,Stubhan, F,&Merkel, KH.(1999).a-SiCx : H films deposited by plasma-enhanced chemical vapor deposition at low temperature used for moisture and corrosion resistant applications.THIN SOLID FILMS,352(1-2),97-101. |
MLA | Jiang, LJ,et al."a-SiCx : H films deposited by plasma-enhanced chemical vapor deposition at low temperature used for moisture and corrosion resistant applications".THIN SOLID FILMS 352.1-2(1999):97-101. |
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