中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology

文献类型:期刊论文

作者Gu, L ; Li, XX ; Bao, HF ; Liu, B ; Wang, YL ; Liu, M ; Yang, ZX ; Cheng, BL
刊名JOURNAL OF MICROMECHANICS AND MICROENGINEERING
出版日期2006-01-01
卷号16期号:7页码:1349-1357
关键词HIGH-ASPECT-RATIO CRYSTAL SILICON COMB ACTUATORS MICROSTRUCTURES MICROACTUATORS FABRICATION MEMS MASK
ISSN号0960-1317
通讯作者Li, XX, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, 865 Changning Rd, Shanghai 200050, Peoples R China
学科主题Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics
收录类别SCI
语种英语
公开日期2011-11-08
源URL[http://ir.sim.ac.cn/handle/331004/17297]  
专题上海微系统与信息技术研究所_太赫兹、微波射频技术_期刊论文
推荐引用方式
GB/T 7714
Gu, L,Li, XX,Bao, HF,et al. Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2006,16(7):1349-1357.
APA Gu, L.,Li, XX.,Bao, HF.,Liu, B.,Wang, YL.,...&Cheng, BL.(2006).Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,16(7),1349-1357.
MLA Gu, L,et al."Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 16.7(2006):1349-1357.

入库方式: OAI收割

来源:上海微系统与信息技术研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。