Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology
文献类型:期刊论文
作者 | Gu, L ; Li, XX ; Bao, HF ; Liu, B ; Wang, YL ; Liu, M ; Yang, ZX ; Cheng, BL |
刊名 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING
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出版日期 | 2006-01-01 |
卷号 | 16期号:7页码:1349-1357 |
关键词 | HIGH-ASPECT-RATIO CRYSTAL SILICON COMB ACTUATORS MICROSTRUCTURES MICROACTUATORS FABRICATION MEMS MASK |
ISSN号 | 0960-1317 |
通讯作者 | Li, XX, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2011-11-08 |
源URL | [http://ir.sim.ac.cn/handle/331004/17297] ![]() |
专题 | 上海微系统与信息技术研究所_太赫兹、微波射频技术_期刊论文 |
推荐引用方式 GB/T 7714 | Gu, L,Li, XX,Bao, HF,et al. Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2006,16(7):1349-1357. |
APA | Gu, L.,Li, XX.,Bao, HF.,Liu, B.,Wang, YL.,...&Cheng, BL.(2006).Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,16(7),1349-1357. |
MLA | Gu, L,et al."Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 16.7(2006):1349-1357. |
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