Investigation on the controllable growth of monodisperse silica colloid abrasives for the chemical mechanical polishing application
文献类型:期刊论文
作者 | Hu, XK ; Song, ZT ; Wang, HB ; Liu, WL ; Zhang, ZF |
刊名 | MICROELECTRONIC ENGINEERING
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出版日期 | 2010 |
卷号 | 87期号:9页码:1751-1755 |
关键词 | MATERIAL REMOVAL RATE SOL-GEL METHOD SODIUM-SILICATE SLURRY PLANARIZATION FABRICATION PARTICLES CRYSTALS WAFERS |
ISSN号 | 0167-9317 |
通讯作者 | Hu, XK, 865 Changning Rd, Shanghai 200050, Peoples R China |
学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics, Applied |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2012-03-24 |
源URL | [http://ir.sim.ac.cn/handle/331004/94639] ![]() |
专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
推荐引用方式 GB/T 7714 | Hu, XK,Song, ZT,Wang, HB,et al. Investigation on the controllable growth of monodisperse silica colloid abrasives for the chemical mechanical polishing application[J]. MICROELECTRONIC ENGINEERING,2010,87(9):1751-1755. |
APA | Hu, XK,Song, ZT,Wang, HB,Liu, WL,&Zhang, ZF.(2010).Investigation on the controllable growth of monodisperse silica colloid abrasives for the chemical mechanical polishing application.MICROELECTRONIC ENGINEERING,87(9),1751-1755. |
MLA | Hu, XK,et al."Investigation on the controllable growth of monodisperse silica colloid abrasives for the chemical mechanical polishing application".MICROELECTRONIC ENGINEERING 87.9(2010):1751-1755. |
入库方式: OAI收割
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