Ge Incorporation in HfO2 Dielectric Deposited on Ge Substrate during Dry/Wet Thermal Annealing
文献类型:期刊论文
作者 | Liu, GZ ; Li, C ; Lai, HK ; Chen, SY |
刊名 | JOURNAL OF THE ELECTROCHEMICAL SOCIETY
![]() |
出版日期 | 2010 |
卷号 | 157期号:6页码:H603-H606 |
关键词 | GERMANIUM LAYER XPS |
ISSN号 | 0013-4651 |
通讯作者 | Liu, GZ, Xiamen Univ, Dept Phys, Semicond Photon Res Ctr, Xiamen 361005, Peoples R China |
学科主题 | Electrochemistry; Materials Science, Coatings & Films |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2012-03-24 |
源URL | [http://ir.sim.ac.cn/handle/331004/94646] ![]() |
专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
推荐引用方式 GB/T 7714 | Liu, GZ,Li, C,Lai, HK,et al. Ge Incorporation in HfO2 Dielectric Deposited on Ge Substrate during Dry/Wet Thermal Annealing[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2010,157(6):H603-H606. |
APA | Liu, GZ,Li, C,Lai, HK,&Chen, SY.(2010).Ge Incorporation in HfO2 Dielectric Deposited on Ge Substrate during Dry/Wet Thermal Annealing.JOURNAL OF THE ELECTROCHEMICAL SOCIETY,157(6),H603-H606. |
MLA | Liu, GZ,et al."Ge Incorporation in HfO2 Dielectric Deposited on Ge Substrate during Dry/Wet Thermal Annealing".JOURNAL OF THE ELECTROCHEMICAL SOCIETY 157.6(2010):H603-H606. |
入库方式: OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。