A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications
文献类型：期刊论文
| 作者 | Geng, F ; Ding, XY ; Xu, GW ; Luo, L |
| 刊名 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING
 |
| 出版日期 | 2009 |
| 卷号 | 19期号:10页码:105011-105011 |
| 关键词 | HIGH-DENSITY INTERCONNECT BCB |
| ISSN号 | 0960-1317 |
| 通讯作者 | Geng, F, Chinese Acad Sci, Grad Sch, Beijing 100049, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94772]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Geng, F,Ding, XY,Xu, GW,et al. A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2009,19(10):105011-105011. |
| APA | Geng, F,Ding, XY,Xu, GW,&Luo, L.(2009).A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,19(10),105011-105011. |
| MLA | Geng, F,et al."A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 19.10(2009):105011-105011. |
入库方式： OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。