Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device
文献类型：期刊论文
| 作者 | Cao, YH ; Ning, WG ; Luo, L |
| 刊名 | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
 |
| 出版日期 | 2009 |
| 卷号 | 32期号:3页码:125-132 |
| 关键词 | EUTECTIC SNPB CU-SN COPPER |
| ISSN号 | 1521-334X |
| 通讯作者 | Cao, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Labs Transducer Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Manufacturing |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94773]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Cao, YH,Ning, WG,Luo, L. Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device[J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,2009,32(3):125-132. |
| APA | Cao, YH,Ning, WG,&Luo, L.(2009).Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device.IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,32(3),125-132. |
| MLA | Cao, YH,et al."Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device".IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 32.3(2009):125-132. |
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