Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate
文献类型:期刊论文
作者 | Ding, XY ; Geng, F ; Luo, L |
刊名 | MICROELECTRONIC ENGINEERING
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出版日期 | 2009 |
卷号 | 86期号:3页码:335-339 |
关键词 | BENZOCYCLOBUTENE MODULES |
ISSN号 | 0167-9317 |
通讯作者 | Ding, XY, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics, Applied |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2012-03-24 |
源URL | [http://ir.sim.ac.cn/handle/331004/94784] ![]() |
专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
推荐引用方式 GB/T 7714 | Ding, XY,Geng, F,Luo, L. Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate[J]. MICROELECTRONIC ENGINEERING,2009,86(3):335-339. |
APA | Ding, XY,Geng, F,&Luo, L.(2009).Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate.MICROELECTRONIC ENGINEERING,86(3),335-339. |
MLA | Ding, XY,et al."Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate".MICROELECTRONIC ENGINEERING 86.3(2009):335-339. |
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