Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate
文献类型：期刊论文
| 作者 | Ding, XY ; Geng, F ; Luo, L |
| 刊名 | MICROELECTRONIC ENGINEERING
 |
| 出版日期 | 2009 |
| 卷号 | 86期号:3页码:335-339 |
| 关键词 | BENZOCYCLOBUTENE MODULES |
| ISSN号 | 0167-9317 |
| 通讯作者 | Ding, XY, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94784]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Ding, XY,Geng, F,Luo, L. Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate[J]. MICROELECTRONIC ENGINEERING,2009,86(3):335-339. |
| APA | Ding, XY,Geng, F,&Luo, L.(2009).Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate.MICROELECTRONIC ENGINEERING,86(3),335-339. |
| MLA | Ding, XY,et al."Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate".MICROELECTRONIC ENGINEERING 86.3(2009):335-339. |
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