SEGREGATION OF CU IMPURITY IN ALUMINUM ON SILICON DURING HIGH-DOSE NITROGEN-ION IMPLANTATION
文献类型:期刊论文
作者 | LIN, CL ; HEMMENT, PLF ; LI, JH ; CHAN, CWM |
刊名 | MATERIALS LETTERS
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出版日期 | 1992 |
卷号 | 15期号:1-2页码:137-140 |
关键词 | NITRIDE IR |
ISSN号 | 0167-577X |
通讯作者 | LIN, CL, UNIV SURREY,DEPT ELECTR & ELECT ENGN,GUILDFORD GU2 5XH,SURREY,ENGLAND |
学科主题 | Materials Science, Multidisciplinary; Physics, Applied |
收录类别 | SCI |
原文出处 | http://www.sciencedirect.com/science/article/pii/0167577X9290029J |
语种 | 英语 |
公开日期 | 2012-03-25 |
源URL | [http://ir.sim.ac.cn/handle/331004/98400] ![]() |
专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文(1999年以前) |
推荐引用方式 GB/T 7714 | LIN, CL,HEMMENT, PLF,LI, JH,et al. SEGREGATION OF CU IMPURITY IN ALUMINUM ON SILICON DURING HIGH-DOSE NITROGEN-ION IMPLANTATION[J]. MATERIALS LETTERS,1992,15(1-2):137-140. |
APA | LIN, CL,HEMMENT, PLF,LI, JH,&CHAN, CWM.(1992).SEGREGATION OF CU IMPURITY IN ALUMINUM ON SILICON DURING HIGH-DOSE NITROGEN-ION IMPLANTATION.MATERIALS LETTERS,15(1-2),137-140. |
MLA | LIN, CL,et al."SEGREGATION OF CU IMPURITY IN ALUMINUM ON SILICON DURING HIGH-DOSE NITROGEN-ION IMPLANTATION".MATERIALS LETTERS 15.1-2(1992):137-140. |
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