Endurance of lead-free assembly under board level drop test and thermal cycling
文献类型：期刊论文
| 作者 | Xia, YH ; Me, XM |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2008 |
| 卷号 | 457期号:1-2页码:198-203 |
| 关键词 | SCALE PACKAGE INTERCONNECTIONS INTERFACIAL REACTIONS FREE SOLDERS RELIABILITY IMPACT SN NI JOINTS |
| ISSN号 | 0925-8388 |
| 通讯作者 | Xia, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai 200050, Peoples R China |
| 学科主题 | Chemistry, Physical; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94918]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xia, YH,Me, XM. Endurance of lead-free assembly under board level drop test and thermal cycling[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2008,457(1-2):198-203. |
| APA | Xia, YH,&Me, XM.(2008).Endurance of lead-free assembly under board level drop test and thermal cycling.JOURNAL OF ALLOYS AND COMPOUNDS,457(1-2),198-203. |
| MLA | Xia, YH,et al."Endurance of lead-free assembly under board level drop test and thermal cycling".JOURNAL OF ALLOYS AND COMPOUNDS 457.1-2(2008):198-203. |
入库方式： OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。