A method for AlCu interconnect electromigration performance predicting and monitoring
文献类型：期刊论文
| 作者 | Zhang, WJ ; Yi, LW ; Chang, PY ; Wu, J |
| 刊名 | MICROELECTRONIC ENGINEERING
 |
| 出版日期 | 2008 |
| 卷号 | 85期号:3页码:577-581 |
| 关键词 | TEXTURE LINES FILMS |
| ISSN号 | 0167-9317 |
| 通讯作者 | Zhang, WJ, Grace Semicond Mfg Corp, Film Dept, Guoshoujing Rd 818,Zhangjiang Hi Teck Pk, Shanghai 201203, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94940]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhang, WJ,Yi, LW,Chang, PY,et al. A method for AlCu interconnect electromigration performance predicting and monitoring[J]. MICROELECTRONIC ENGINEERING,2008,85(3):577-581. |
| APA | Zhang, WJ,Yi, LW,Chang, PY,&Wu, J.(2008).A method for AlCu interconnect electromigration performance predicting and monitoring.MICROELECTRONIC ENGINEERING,85(3),577-581. |
| MLA | Zhang, WJ,et al."A method for AlCu interconnect electromigration performance predicting and monitoring".MICROELECTRONIC ENGINEERING 85.3(2008):577-581. |
入库方式： OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。