Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability
文献类型：期刊论文
| 作者 | Lin, XQ ; Luo, L |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 出版日期 | 2008 |
| 卷号 | 37期号:3页码:307-313 |
| 关键词 | EUTECTIC SNPB TIN-LEAD JOINTS CU GROWTH COPPER MICROSTRUCTURE INTERMETALLICS TECHNOLOGY MORPHOLOGY |
| ISSN号 | 0361-5235 |
| 通讯作者 | Lin, XQ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94975]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Lin, XQ,Luo, L. Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability[J]. JOURNAL OF ELECTRONIC MATERIALS,2008,37(3):307-313. |
| APA | Lin, XQ,&Luo, L.(2008).Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability.JOURNAL OF ELECTRONIC MATERIALS,37(3),307-313. |
| MLA | Lin, XQ,et al."Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability".JOURNAL OF ELECTRONIC MATERIALS 37.3(2008):307-313. |
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