Study on Void Growth in Micro-Size SnAg Solder Bump
文献类型：期刊论文
| 作者 | Lin, XQ ; Luo, L |
| 刊名 | RARE METAL MATERIALS AND ENGINEERING
 |
| 出版日期 | 2008 |
| 卷号 | 37期号:11页码:1903-1907 |
| 关键词 | EUTECTIC SNPB TIN-LEAD JOINTS CU RELIABILITY EVOLUTION COPPER MICROSTRUCTURE INTERMETALLICS TECHNOLOGY |
| ISSN号 | 1002-185X |
| 通讯作者 | Lin, XQ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 中文 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/94990]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Lin, XQ,Luo, L. Study on Void Growth in Micro-Size SnAg Solder Bump[J]. RARE METAL MATERIALS AND ENGINEERING,2008,37(11):1903-1907. |
| APA | Lin, XQ,&Luo, L.(2008).Study on Void Growth in Micro-Size SnAg Solder Bump.RARE METAL MATERIALS AND ENGINEERING,37(11),1903-1907. |
| MLA | Lin, XQ,et al."Study on Void Growth in Micro-Size SnAg Solder Bump".RARE METAL MATERIALS AND ENGINEERING 37.11(2008):1903-1907. |
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