Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections
文献类型：期刊论文
| 作者 | Xu, GW ; Wu, YH ; Geng, F ; Huang, QP ; Zhou, J ; Luo, L |
| 刊名 | 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2
 |
| 出版日期 | 2008 |
| 页码 | 111-116 |
| 关键词 | DESIGN BGA |
| 通讯作者 | Xu, GW, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Engineering, Mechanical |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95023]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xu, GW,Wu, YH,Geng, F,et al. Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections[J]. 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,2008:111-116. |
| APA | Xu, GW,Wu, YH,Geng, F,Huang, QP,Zhou, J,&Luo, L.(2008).Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections.2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,111-116. |
| MLA | Xu, GW,et al."Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections".2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2 (2008):111-116. |
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