Thermal Management and testing of MCM with embedded chip in Silicon Substrate
文献类型：期刊论文
| 作者 | Geng, F ; Tang, JJ ; Luo, L |
| 刊名 | 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2
 |
| 出版日期 | 2008 |
| 页码 | 165-170 |
| 关键词 | BCB INTERCONNECTS |
| 通讯作者 | Geng, F, Chinese Acad Sci, ShangHai Inst Microsyst & Informat Technol, Changning Rd 865, Shanghai, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Engineering, Mechanical |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95025]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Geng, F,Tang, JJ,Luo, L. Thermal Management and testing of MCM with embedded chip in Silicon Substrate[J]. 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,2008:165-170. |
| APA | Geng, F,Tang, JJ,&Luo, L.(2008).Thermal Management and testing of MCM with embedded chip in Silicon Substrate.2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,165-170. |
| MLA | Geng, F,et al."Thermal Management and testing of MCM with embedded chip in Silicon Substrate".2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2 (2008):165-170. |
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