A silicon micromachined high-shock accelerometer with a bonded hinge structure
文献类型：期刊论文
| 作者 | Fan, KB ; Che, LF ; Xiong, B ; Wang, YL |
| 刊名 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING
 |
| 出版日期 | 2007 |
| 卷号 | 17期号:6页码:1206-1210 |
| 关键词 | PIEZORESISTIVE ACCELEROMETERS FABRICATION |
| ISSN号 | 0960-1317 |
| 通讯作者 | Che, LF, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science, Multidisciplinary; Mechanics |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95034]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Fan, KB,Che, LF,Xiong, B,et al. A silicon micromachined high-shock accelerometer with a bonded hinge structure[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2007,17(6):1206-1210. |
| APA | Fan, KB,Che, LF,Xiong, B,&Wang, YL.(2007).A silicon micromachined high-shock accelerometer with a bonded hinge structure.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,17(6),1206-1210. |
| MLA | Fan, KB,et al."A silicon micromachined high-shock accelerometer with a bonded hinge structure".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 17.6(2007):1206-1210. |
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