中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Colloidal nano-abrasives and slurry for chemical-mechanical polishing of semiconductor materials

文献类型:期刊论文

作者Zhang, KL ; Song, ZT ; Lin, CL ; Feng, SF ; Chen, B
刊名JOURNAL OF CERAMIC PROCESSING RESEARCH
出版日期2007
卷号8期号:1页码:52-55
关键词PLANARIZATION
ISSN号1229-9162
通讯作者Zhang, KL, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Lab Nano Technol, Res Ctr Funct Semicond Film Engn & Technol, Shanghai 200050, Peoples R China
学科主题Materials Science, Ceramics
收录类别SCI
原文出处http://apps.webofknowledge.com/full_record.do?product=WOS&search_mode=GeneralSearch&qid=43&SID=Z1inl9pjJoL49g8jCge&page=1&doc=1
语种英语
公开日期2012-03-24
源URL[http://ir.sim.ac.cn/handle/331004/95035]  
专题上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式
GB/T 7714
Zhang, KL,Song, ZT,Lin, CL,et al. Colloidal nano-abrasives and slurry for chemical-mechanical polishing of semiconductor materials[J]. JOURNAL OF CERAMIC PROCESSING RESEARCH,2007,8(1):52-55.
APA Zhang, KL,Song, ZT,Lin, CL,Feng, SF,&Chen, B.(2007).Colloidal nano-abrasives and slurry for chemical-mechanical polishing of semiconductor materials.JOURNAL OF CERAMIC PROCESSING RESEARCH,8(1),52-55.
MLA Zhang, KL,et al."Colloidal nano-abrasives and slurry for chemical-mechanical polishing of semiconductor materials".JOURNAL OF CERAMIC PROCESSING RESEARCH 8.1(2007):52-55.

入库方式: OAI收割

来源:上海微系统与信息技术研究所

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