Chemical mechanical polishing and a succedent reactive ion etching processing of sapphire wafer
文献类型：期刊论文
| 作者 | Wang, LY ; Zhang, KL ; Song, ZT ; Feng, SL |
| 刊名 | JOURNAL OF THE ELECTROCHEMICAL SOCIETY
 |
| 出版日期 | 2007 |
| 卷号 | 154期号:3页码:H166-H169 |
| 关键词 | MIXED ABRASIVE SLURRIES PLASMAS FILMS PH |
| ISSN号 | 0013-4651 |
| 通讯作者 | Wang, LY, Chinese Acad Sci, Grad Sch, Shanghai Inst Microsyst & Informat Technol, Res Ctr Funct Semicond Film Engn & Technol,Lab Na, Shanghai 200050, Peoples R China |
| 学科主题 | Electrochemistry; Materials Science, Coatings & Films |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95069]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wang, LY,Zhang, KL,Song, ZT,et al. Chemical mechanical polishing and a succedent reactive ion etching processing of sapphire wafer[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2007,154(3):H166-H169. |
| APA | Wang, LY,Zhang, KL,Song, ZT,&Feng, SL.(2007).Chemical mechanical polishing and a succedent reactive ion etching processing of sapphire wafer.JOURNAL OF THE ELECTROCHEMICAL SOCIETY,154(3),H166-H169. |
| MLA | Wang, LY,et al."Chemical mechanical polishing and a succedent reactive ion etching processing of sapphire wafer".JOURNAL OF THE ELECTROCHEMICAL SOCIETY 154.3(2007):H166-H169. |
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