The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength
文献类型：期刊论文
| 作者 | Lin, XQ ; Luo, L |
| 刊名 | ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS
 |
| 出版日期 | 2007 |
| 页码 | 385-389 |
| 关键词 | EUTECTIC SNPB JOINTS CU MICROSTRUCTURE RELIABILITY TECHNOLOGY EVOLUTION |
| 通讯作者 | Lin, XQ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95109]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Lin, XQ,Luo, L. The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength[J]. ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS,2007:385-389. |
| APA | Lin, XQ,&Luo, L.(2007).The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength.ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS,385-389. |
| MLA | Lin, XQ,et al."The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength".ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS (2007):385-389. |
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