Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests
文献类型：期刊论文
| 作者 | Xia, Y ; Lu, C ; Xle, X |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 出版日期 | 2007 |
| 卷号 | 36期号:9页码:1129-1136 |
| 关键词 | SOLDER JOINTS PACKAGE RELIABILITY COMPOUND FORMATION TFBGA PACKAGES IC PACKAGES IMPACT CU INTERCONNECTIONS METALLIZATION SIMULATION |
| ISSN号 | 0361-5235 |
| 通讯作者 | Xia, Y, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Funct Mat Informat, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95140]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xia, Y,Lu, C,Xle, X. Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests[J]. JOURNAL OF ELECTRONIC MATERIALS,2007,36(9):1129-1136. |
| APA | Xia, Y,Lu, C,&Xle, X.(2007).Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests.JOURNAL OF ELECTRONIC MATERIALS,36(9),1129-1136. |
| MLA | Xia, Y,et al."Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests".JOURNAL OF ELECTRONIC MATERIALS 36.9(2007):1129-1136. |
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