Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints
文献类型：期刊论文
| 作者 | Xia, YH ; Lu, CY ; Chang, JL ; Xie, XM |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 出版日期 | 2006 |
| 卷号 | 35期号:5页码:897-904 |
| 关键词 | SN-AG-CU INTERFACIAL MICROSTRUCTURE EVOLUTION WETTING REACTION SNAGCU SOLDER THIN-FILMS NI METALLIZATION STRENGTH KINETICS PACKAGES |
| ISSN号 | 0361-5235 |
| 通讯作者 | Xia, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95157]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xia, YH,Lu, CY,Chang, JL,et al. Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints[J]. JOURNAL OF ELECTRONIC MATERIALS,2006,35(5):897-904. |
| APA | Xia, YH,Lu, CY,Chang, JL,&Xie, XM.(2006).Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints.JOURNAL OF ELECTRONIC MATERIALS,35(5),897-904. |
| MLA | Xia, YH,et al."Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints".JOURNAL OF ELECTRONIC MATERIALS 35.5(2006):897-904. |
入库方式： OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。