A quick method for AlCu interconnect electromigration performance predicting and monitoring
文献类型：期刊论文
| 作者 | Zhang,WJ ; Yi,L ; Tao,K ; Ma,Y ; Chang,PY ; Mao,DL ; Wu,J ; Zou,SC |
| 刊名 | SEMICONDUCTOR SCIENCE AND TECHNOLOGY
 |
| 出版日期 | 2006 |
| 卷号 | 21期号:5页码:633-637 |
| 关键词 | TEXTURE BEHAVIOR FILMS |
| ISSN号 | 0268-1242 |
| 通讯作者 | Zhang, WJ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China |
| 学科主题 | Engineering ; Electrical & Electronic; Materials Science ; Multidisciplinary; Physics ; Condensed Matter |
| 收录类别 | SCI |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95160]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhang,WJ,Yi,L,Tao,K,et al. A quick method for AlCu interconnect electromigration performance predicting and monitoring[J]. SEMICONDUCTOR SCIENCE AND TECHNOLOGY,2006,21(5):633-637. |
| APA | Zhang,WJ.,Yi,L.,Tao,K.,Ma,Y.,Chang,PY.,...&Zou,SC.(2006).A quick method for AlCu interconnect electromigration performance predicting and monitoring.SEMICONDUCTOR SCIENCE AND TECHNOLOGY,21(5),633-637. |
| MLA | Zhang,WJ,et al."A quick method for AlCu interconnect electromigration performance predicting and monitoring".SEMICONDUCTOR SCIENCE AND TECHNOLOGY 21.5(2006):633-637. |
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