Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging
文献类型：期刊论文
| 作者 | Xia, YH ; Xie, XM ; Lu, CY ; Chang, JL |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2006 |
| 卷号 | 417期号:1-2页码:143-149 |
| 关键词 | WT-PERCENT CU LEAD-FREE SOLDERS INTERFACIAL REACTIONS SN-3.5-PERCENT-AG SOLDER BUMP METALLIZATION SN NI ALLOYS REFLOW MICROSTRUCTURE |
| ISSN号 | 0925-8388 |
| 通讯作者 | Xia, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Chemistry, Physical; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95162]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xia, YH,Xie, XM,Lu, CY,et al. Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2006,417(1-2):143-149. |
| APA | Xia, YH,Xie, XM,Lu, CY,&Chang, JL.(2006).Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging.JOURNAL OF ALLOYS AND COMPOUNDS,417(1-2),143-149. |
| MLA | Xia, YH,et al."Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging".JOURNAL OF ALLOYS AND COMPOUNDS 417.1-2(2006):143-149. |
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