Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging
文献类型：期刊论文
| 作者 | Xia, YH ; Xie, XM ; Xie, XM ; Lu, CY |
| 刊名 | JOURNAL OF MATERIALS SCIENCE
 |
| 出版日期 | 2006 |
| 卷号 | 41期号:8页码:2359-2364 |
| 关键词 | FLIP-CHIP TECHNOLOGY INTERFACIAL MICROSTRUCTURE SNAGCU SOLDER TIN-LEAD GROWTH JOINTS COPPER |
| ISSN号 | 0022-2461 |
| 通讯作者 | Xia, YH, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Materials Science, Multidisciplinary |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95202]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Xia, YH,Xie, XM,Xie, XM,et al. Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging[J]. JOURNAL OF MATERIALS SCIENCE,2006,41(8):2359-2364. |
| APA | Xia, YH,Xie, XM,Xie, XM,&Lu, CY.(2006).Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging.JOURNAL OF MATERIALS SCIENCE,41(8),2359-2364. |
| MLA | Xia, YH,et al."Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging".JOURNAL OF MATERIALS SCIENCE 41.8(2006):2359-2364. |
入库方式： OAI收割
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