Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process
文献类型：期刊论文
| 作者 | Zhu, DP ; Le, L |
| 刊名 | ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings
 |
| 出版日期 | 2006 |
| 页码 | 51-54 |
| 关键词 | INTERMETALLIC COMPOUND FORMATION FLIP-CHIP TECHNOLOGY SN-3.5AG SOLDER AG SOLDER METALLIZATION RELIABILITY |
| 通讯作者 | Zhu, DP, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, 865 Chang Ning Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95223]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhu, DP,Le, L. Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process[J]. ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings,2006:51-54. |
| APA | Zhu, DP,&Le, L.(2006).Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process.ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings,51-54. |
| MLA | Zhu, DP,et al."Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process".ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings (2006):51-54. |
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