The influence of substrate bias in I-PVD process on the properties of Ti and Al alloy films
文献类型:期刊论文
作者 | Zhang, WJ ; Yi, L ; Tao, K ; Ma, Y ; Chang, PY ; Wu, J |
刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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出版日期 | 2006 |
卷号 | 17期号:11页码:931-935 |
关键词 | THIN-FILMS ELECTROMIGRATION TEXTURE INTERCONNECTS MICROSTRUCTURE METALLIZATION UNDERLAYER ROUGHNESS |
ISSN号 | 0957-4522 |
通讯作者 | Zhang, WJ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China |
学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied; Physics, Condensed Matter |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2012-03-24 |
源URL | [http://ir.sim.ac.cn/handle/331004/95240] ![]() |
专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
推荐引用方式 GB/T 7714 | Zhang, WJ,Yi, L,Tao, K,et al. The influence of substrate bias in I-PVD process on the properties of Ti and Al alloy films[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2006,17(11):931-935. |
APA | Zhang, WJ,Yi, L,Tao, K,Ma, Y,Chang, PY,&Wu, J.(2006).The influence of substrate bias in I-PVD process on the properties of Ti and Al alloy films.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,17(11),931-935. |
MLA | Zhang, WJ,et al."The influence of substrate bias in I-PVD process on the properties of Ti and Al alloy films".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 17.11(2006):931-935. |
入库方式: OAI收割
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