Electromigration in Al interconnects and the challenges in ultra-deep submicron technology
文献类型：期刊论文
| 作者 | Zhang, WJ(张文杰） ; Yi, WB（易万兵） ; Wu, J（吴瑾） |
| 刊名 | ACTA PHYSICA SINICA
 |
| 出版日期 | 2006 |
| 卷号 | 55期号:10页码:5424-5434 |
| 关键词 | THIN-FILMS TRANSPORT MECHANISMS DUAL-DAMASCENE ALUMINUM FILMS TEXTURE GROWTH GRAIN TI RELIABILITY UNDERLAYER |
| ISSN号 | 1000-3290 |
| 通讯作者 | Zhang, WJ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Physics, Multidisciplinary |
| 收录类别 | SCI |
| 原文出处 | http://www.cnki.net/kcms/detail/detail.aspx?Quer20120228ID=1&CurRec=1&DbCode=CJFQ&dbname=CJFD0608&filename=WLXB200610073&uid=WEEvREcwSlJHSldRa1FiOS9VZHNRK0lqdEJl201202283k4R1ZacDBLa3VWRXR6bVNIc2ZLMmF1VUZraHU3WS9iT0s4PQ== |
| 语种 | 中文 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95242]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhang, WJ,Yi, WB,Wu, J. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology[J]. ACTA PHYSICA SINICA,2006,55(10):5424-5434. |
| APA | Zhang, WJ,Yi, WB,&Wu, J.(2006).Electromigration in Al interconnects and the challenges in ultra-deep submicron technology.ACTA PHYSICA SINICA,55(10),5424-5434. |
| MLA | Zhang, WJ,et al."Electromigration in Al interconnects and the challenges in ultra-deep submicron technology".ACTA PHYSICA SINICA 55.10(2006):5424-5434. |
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