Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling
文献类型：期刊论文
| 作者 | Chang, JL ; Janz, D ; Kempe, W ; Xie, XM |
| 刊名 | SOLDERING & SURFACE MOUNT TECHNOLOGY
 |
| 出版日期 | 2005 |
| 卷号 | 17期号:4页码:10-16 |
| 关键词 | LEAD-FREE SOLDERS JOINTS RELIABILITY VOIDS |
| ISSN号 | 0954-0911 |
| 通讯作者 | Chang, JL, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China |
| 学科主题 | Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95317]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Chang, JL,Janz, D,Kempe, W,et al. Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2005,17(4):10-16. |
| APA | Chang, JL,Janz, D,Kempe, W,&Xie, XM.(2005).Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling.SOLDERING & SURFACE MOUNT TECHNOLOGY,17(4),10-16. |
| MLA | Chang, JL,et al."Degradation of Sn-Ag-Cu heat-sink attachment during thermal shock cycling".SOLDERING & SURFACE MOUNT TECHNOLOGY 17.4(2005):10-16. |
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