The growth behavior of Cu-Sn intermetallic compounds during aging
文献类型：期刊论文
| 作者 | Chang, JL ; Janz, D ; Liu, XQ ; Yu, LH ; Xie, XM |
| 刊名 | RARE METAL MATERIALS AND ENGINEERING
 |
| 出版日期 | 2005 |
| 卷号 | 34页码:332-335 |
| 关键词 | SOLDER JOINTS MICROSTRUCTURE RELIABILITY INTERFACES EVOLUTION |
| ISSN号 | 1002-185X |
| 通讯作者 | Chang, JL, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China |
| 学科主题 | Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95363]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Chang, JL,Janz, D,Liu, XQ,et al. The growth behavior of Cu-Sn intermetallic compounds during aging[J]. RARE METAL MATERIALS AND ENGINEERING,2005,34:332-335. |
| APA | Chang, JL,Janz, D,Liu, XQ,Yu, LH,&Xie, XM.(2005).The growth behavior of Cu-Sn intermetallic compounds during aging.RARE METAL MATERIALS AND ENGINEERING,34,332-335. |
| MLA | Chang, JL,et al."The growth behavior of Cu-Sn intermetallic compounds during aging".RARE METAL MATERIALS AND ENGINEERING 34(2005):332-335. |
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