Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop
文献类型：期刊论文
| 作者 | Huang, WD ; Wang, XH ; Wang, L ; Sheng, M ; Xu, LQ ; Stubhan, F ; Luo, L |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 出版日期 | 2004 |
| 卷号 | 33期号:2页码:101-105 |
| ISSN号 | 0361-5235 |
| 通讯作者 | Huang, WD, Espec Environm Equipment Shanghai Co Ltd, Reliabil Test Ctr, Shanghai 200122, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95419]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Huang, WD,Wang, XH,Wang, L,et al. Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop[J]. JOURNAL OF ELECTRONIC MATERIALS,2004,33(2):101-105. |
| APA | Huang, WD.,Wang, XH.,Wang, L.,Sheng, M.,Xu, LQ.,...&Luo, L.(2004).Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop.JOURNAL OF ELECTRONIC MATERIALS,33(2),101-105. |
| MLA | Huang, WD,et al."Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop".JOURNAL OF ELECTRONIC MATERIALS 33.2(2004):101-105. |
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