中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints

文献类型:期刊论文

作者Chang, JL ; Xia, YH ; Xie, XM
刊名PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04)
出版日期2004
页码66-69
关键词INTERFACIAL REACTIONS RELIABILITY
通讯作者Xie, XM, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China
学科主题Engineering, Manufacturing; Engineering, Electrical & Electronic
收录类别SCI
语种英语
公开日期2012-03-24
源URL[http://ir.sim.ac.cn/handle/331004/95431]  
专题上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式
GB/T 7714
Chang, JL,Xia, YH,Xie, XM. On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints[J]. PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04),2004:66-69.
APA Chang, JL,Xia, YH,&Xie, XM.(2004).On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints.PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04),66-69.
MLA Chang, JL,et al."On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints".PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04) (2004):66-69.

入库方式: OAI收割

来源:上海微系统与信息技术研究所

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