On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints
文献类型：期刊论文
| 作者 | Chang, JL ; Xia, YH ; Xie, XM |
| 刊名 | PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04)
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| 出版日期 | 2004 |
| 页码 | 66-69 |
| 关键词 | INTERFACIAL REACTIONS RELIABILITY |
| 通讯作者 | Xie, XM, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, 865 Changning Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Manufacturing; Engineering, Electrical & Electronic |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95431]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Chang, JL,Xia, YH,Xie, XM. On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints[J]. PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04),2004:66-69. |
| APA | Chang, JL,Xia, YH,&Xie, XM.(2004).On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints.PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04),66-69. |
| MLA | Chang, JL,et al."On the formation of Cu-Ni-Sn ternary intermetallics in SNIT solder joints".PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04) (2004):66-69. |
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