Thermal analysis for multichip module using computational fluid dynamic simulation
文献类型：期刊论文
| 作者 | Cheng, YJ ; Zhu, WJ ; Zhu, R ; Xu, GW ; Luo, L |
| 刊名 | PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04)
 |
| 出版日期 | 2004 |
| 页码 | 326-330 |
| 关键词 | FLIP-CHIP CFD CODE OPTIMIZATION PACKAGES DESIGN TOOL |
| 通讯作者 | Cheng, YJ, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Changning 200050, Shanghai, Peoples R China |
| 学科主题 | Engineering, Manufacturing; Engineering, Electrical & Electronic |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95446]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Cheng, YJ,Zhu, WJ,Zhu, R,et al. Thermal analysis for multichip module using computational fluid dynamic simulation[J]. PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04),2004:326-330. |
| APA | Cheng, YJ,Zhu, WJ,Zhu, R,Xu, GW,&Luo, L.(2004).Thermal analysis for multichip module using computational fluid dynamic simulation.PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04),326-330. |
| MLA | Cheng, YJ,et al."Thermal analysis for multichip module using computational fluid dynamic simulation".PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04) (2004):326-330. |
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