Lifetime of solder joint and delamination in flip chip assemblies
文献类型：期刊论文
| 作者 | Cheng, ZN |
| 刊名 | 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS
 |
| 出版日期 | 2004 |
| 页码 | 174-186 |
| 关键词 | UNDERFILL MATERIAL PROPERTIES FATIGUE RELIABILITY RELAXATION STRESS MODEL INTERFACES PACKAGE GLASS |
| 通讯作者 | Cheng, ZN, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, MEMS Packaging LAB, Beijing 100864, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95458]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Cheng, ZN. Lifetime of solder joint and delamination in flip chip assemblies[J]. 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS,2004:174-186. |
| APA | Cheng, ZN.(2004).Lifetime of solder joint and delamination in flip chip assemblies.2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS,174-186. |
| MLA | Cheng, ZN."Lifetime of solder joint and delamination in flip chip assemblies".2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS (2004):174-186. |
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