Flip chip solder joint reliability under harsh environment
文献类型：期刊论文
| 作者 | Cheng, B ; Wang, L ; Zhang, Q ; Gao, X ; Xie, XM ; Kempe, W |
| 刊名 | SOLDERING & SURFACE MOUNT TECHNOLOGY
 |
| 出版日期 | 2003 |
| 卷号 | 15期号:3页码:15-20 |
| 关键词 | FRACTURE-MECHANICS UNDERFILL ASSEMBLIES PACKAGE LIFE |
| ISSN号 | 0954-0911 |
| 通讯作者 | Cheng, B, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China |
| 学科主题 | Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95528]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Cheng, B,Wang, L,Zhang, Q,et al. Flip chip solder joint reliability under harsh environment[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2003,15(3):15-20. |
| APA | Cheng, B,Wang, L,Zhang, Q,Gao, X,Xie, XM,&Kempe, W.(2003).Flip chip solder joint reliability under harsh environment.SOLDERING & SURFACE MOUNT TECHNOLOGY,15(3),15-20. |
| MLA | Cheng, B,et al."Flip chip solder joint reliability under harsh environment".SOLDERING & SURFACE MOUNT TECHNOLOGY 15.3(2003):15-20. |
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