Tensile strength of zinc oxide films measured by a microbridge method
文献类型：期刊论文
| 作者 | Ong, CW ; Zong, DG ; Aravind, M ; Choy, CL ; Lu, DR |
| 刊名 | JOURNAL OF MATERIALS RESEARCH
 |
| 出版日期 | 2003 |
| 卷号 | 18期号:10页码:2464-2472 |
| 关键词 | NITRIDE THIN-FILMS SILICON-WAFERS MODULUS ZNO STRESS LOAD |
| ISSN号 | 0884-2914 |
| 通讯作者 | Ong, CW, Hong Kong Polytech Univ, Dept Appl Phys, Kowloon, Hong Kong, Peoples R China |
| 学科主题 | Materials Science, Multidisciplinary |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95559]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Ong, CW,Zong, DG,Aravind, M,et al. Tensile strength of zinc oxide films measured by a microbridge method[J]. JOURNAL OF MATERIALS RESEARCH,2003,18(10):2464-2472. |
| APA | Ong, CW,Zong, DG,Aravind, M,Choy, CL,&Lu, DR.(2003).Tensile strength of zinc oxide films measured by a microbridge method.JOURNAL OF MATERIALS RESEARCH,18(10),2464-2472. |
| MLA | Ong, CW,et al."Tensile strength of zinc oxide films measured by a microbridge method".JOURNAL OF MATERIALS RESEARCH 18.10(2003):2464-2472. |
入库方式： OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。