Thermal stability of electrode stacks for application in oxide film devices
文献类型：期刊论文
| 作者 | Song, ZT ; Chong, N ; Chan, LWHW ; Choy, CL ; Lin, CL |
| 刊名 | THIN SOLID FILMS
 |
| 出版日期 | 2002 |
| 卷号 | 406期号:1-2页码:268-274 |
| 关键词 | SILICON |
| ISSN号 | 0040-6090 |
| 通讯作者 | Song, ZT, Hong Kong Polytech Univ, Dept Appl Phys, Kowloon, Hong Kong, Peoples R China |
| 学科主题 | Materials Science, Multidisciplinary; Materials Science, Coatings & Films; Physics, Applied; Physics, Condensed Matter |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95578]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Song, ZT,Chong, N,Chan, LWHW,et al. Thermal stability of electrode stacks for application in oxide film devices[J]. THIN SOLID FILMS,2002,406(1-2):268-274. |
| APA | Song, ZT,Chong, N,Chan, LWHW,Choy, CL,&Lin, CL.(2002).Thermal stability of electrode stacks for application in oxide film devices.THIN SOLID FILMS,406(1-2),268-274. |
| MLA | Song, ZT,et al."Thermal stability of electrode stacks for application in oxide film devices".THIN SOLID FILMS 406.1-2(2002):268-274. |
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