Viscoplastic Anand model for solder alloys and its application
文献类型：期刊论文
| 作者 | Cheng, ZN ; Wang, GZ ; Chen, L ; Wilde, J ; Becker, K |
| 刊名 | SOLDERING & SURFACE MOUNT TECHNOLOGY
 |
| 出版日期 | 2000 |
| 卷号 | 12期号:2页码:31-36 |
| 关键词 | TIN-LEAD SOLDER CONSTITUTIVE MODEL JOINTS |
| ISSN号 | 0954-0911 |
| 通讯作者 | Cheng, ZN, Shanghai Inst Met, Daimler Chrysler Lab, Shanghai, Peoples R China |
| 学科主题 | Engineering, Manufacturing; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95775]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Cheng, ZN,Wang, GZ,Chen, L,et al. Viscoplastic Anand model for solder alloys and its application[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2000,12(2):31-36. |
| APA | Cheng, ZN,Wang, GZ,Chen, L,Wilde, J,&Becker, K.(2000).Viscoplastic Anand model for solder alloys and its application.SOLDERING & SURFACE MOUNT TECHNOLOGY,12(2),31-36. |
| MLA | Cheng, ZN,et al."Viscoplastic Anand model for solder alloys and its application".SOLDERING & SURFACE MOUNT TECHNOLOGY 12.2(2000):31-36. |
入库方式： OAI收割
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