A novel high performance die attach for ceramic packages
文献类型：期刊论文
| 作者 | Shi, JZ ; Xie, XM ; Stubhan, F ; Freytag, J |
| 刊名 | JOURNAL OF ELECTRONIC PACKAGING
 |
| 出版日期 | 2000 |
| 卷号 | 122期号:2页码:168-171 |
| 关键词 | TEMPERATURE COUPLES |
| ISSN号 | 1043-7398 |
| 通讯作者 | Shi, JZ, Shanghai Inst Met, SIM DaimlerChrysler Lab, 865 Changning Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Engineering, Electrical & Electronic; Engineering, Mechanical |
| 收录类别 | SCI |
| 原文出处 | http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JEPAE4000122000002000168000001&idtype=cvips&gifs=yes&ref=no |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95827]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Shi, JZ,Xie, XM,Stubhan, F,et al. A novel high performance die attach for ceramic packages[J]. JOURNAL OF ELECTRONIC PACKAGING,2000,122(2):168-171. |
| APA | Shi, JZ,Xie, XM,Stubhan, F,&Freytag, J.(2000).A novel high performance die attach for ceramic packages.JOURNAL OF ELECTRONIC PACKAGING,122(2),168-171. |
| MLA | Shi, JZ,et al."A novel high performance die attach for ceramic packages".JOURNAL OF ELECTRONIC PACKAGING 122.2(2000):168-171. |
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