Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si
文献类型：期刊论文
| 作者 | Mu, HC ; Yu, YH ; Luo, EZ ; Sundaravel, B ; Wong, SP ; Wilson, IH |
| 刊名 | JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
 |
| 出版日期 | 2000 |
| 卷号 | 18期号:5页码:2312-2318 |
| 关键词 | TRANSITION-METALS COPPER METALLIZATION LAYERS SILICON MO TA |
| ISSN号 | 0734-2101 |
| 通讯作者 | Mu, HC, Chinese Acad Sci, Shanghai Inst Met, Ion Beam Lab, 865 ChangNing Rd, Shanghai 200050, Peoples R China |
| 学科主题 | Materials Science, Coatings & Films; Physics, Applied |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2012-03-24 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/95839]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Mu, HC,Yu, YH,Luo, EZ,et al. Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,2000,18(5):2312-2318. |
| APA | Mu, HC,Yu, YH,Luo, EZ,Sundaravel, B,Wong, SP,&Wilson, IH.(2000).Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,18(5),2312-2318. |
| MLA | Mu, HC,et al."Ti, TiN, and Ti/TiN thin films prepared by ion beam assisted deposition as diffusion barriers between Cu and Si".JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS 18.5(2000):2312-2318. |
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