Simultaneous Formation Of Through Wafer Electrical Interconnects And Highly Dense & Uniform Nickel Tips For Silicon-Cantilever Probe-Cards,
文献类型：会议论文
| 作者 | Fei Wang, Xinxin Li, Songlin Feng, |
| 出版日期 | 2007 |
| 会议名称 | Transducers’07---The 14th International Conference on Solid State Sensors, Actuators and Microsystems |
| 会议日期 | 2007 |
| 页码 | 2051-2054 |
| 语种 | 英语 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/107615]  |
| 专题 | 上海微系统与信息技术研究所_传感技术联合国家重点实验室_会议论文 |
| 推荐引用方式 GB/T 7714 | Fei Wang, Xinxin Li, Songlin Feng,. Simultaneous Formation Of Through Wafer Electrical Interconnects And Highly Dense & Uniform Nickel Tips For Silicon-Cantilever Probe-Cards,[C]. 见:Transducers’07---The 14th International Conference on Solid State Sensors, Actuators and Microsystems. 2007. |
入库方式： OAI收割
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