Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique
文献类型：期刊论文
| 作者 | Zhou, XF ; Che, LF ; Xiong, B ; Fan, KB ; Wang, YL ; Wang, ZK |
| 刊名 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING
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| 出版日期 | 2010 |
| 卷号 | 20期号:11 Article Number页码:115009 |
| 公开日期 | 2012-05-12 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/108998]  |
| 专题 | 上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhou, XF,Che, LF,Xiong, B,et al. Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2010,20(11 Article Number):115009. |
| APA | Zhou, XF,Che, LF,Xiong, B,Fan, KB,Wang, YL,&Wang, ZK.(2010).Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,20(11 Article Number),115009. |
| MLA | Zhou, XF,et al."Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 20.11 Article Number(2010):115009. |
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