中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique

文献类型:期刊论文

作者Zhou, XF ; Che, LF ; Xiong, B ; Fan, KB ; Wang, YL ; Wang, ZK
刊名JOURNAL OF MICROMECHANICS AND MICROENGINEERING
出版日期2010
卷号20期号:11 Article Number页码:115009
公开日期2012-05-12
源URL[http://ir.sim.ac.cn/handle/331004/108998]  
专题上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文
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Zhou, XF,Che, LF,Xiong, B,et al. Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2010,20(11 Article Number):115009.
APA Zhou, XF,Che, LF,Xiong, B,Fan, KB,Wang, YL,&Wang, ZK.(2010).Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,20(11 Article Number),115009.
MLA Zhou, XF,et al."Single wafer fabrication of a symmetric double-sided beam-mass structure using DRIE and wet etching by a novel vertical sidewall protection technique".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 20.11 Article Number(2010):115009.

入库方式: OAI收割

来源:上海微系统与信息技术研究所

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