Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias
文献类型：期刊论文
| 作者 | Wu, ZY ; Yang, H ; Dou, CG ; Wu, YH ; Li, XX ; Wang, YL |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
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| 出版日期 | 2011 |
| 卷号 | 1期号:9 Pages页码:1345-1349 |
| 公开日期 | 2012-05-12 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109020]  |
| 专题 | 上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wu, ZY,Yang, H,Dou, CG,et al. Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,2011,1(9 Pages):1345-1349. |
| APA | Wu, ZY,Yang, H,Dou, CG,Wu, YH,Li, XX,&Wang, YL.(2011).Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias.IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,1(9 Pages),1345-1349. |
| MLA | Wu, ZY,et al."Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias".IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 1.9 Pages(2011):1345-1349. |
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