The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope
文献类型：期刊论文
| 作者 | Author(s): Jing, ER (Jing, Errong) ; Xiong, B (Xiong, Bin) ; Wang, YL (Wang, Yuelin) |
| 刊名 | Source: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
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| 出版日期 | 2010 |
| 卷号 | 33期号:1页码:31-37 |
| 公开日期 | 2012-05-12 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109028]  |
| 专题 | 上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文 |
| 推荐引用方式 GB/T 7714 | Author,Xiong, B ,Wang, YL . The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope[J]. Source: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,2010,33(1):31-37. |
| APA | Author,Xiong, B ,&Wang, YL .(2010).The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope.Source: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,33(1),31-37. |
| MLA | Author,et al."The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope".Source: IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 33.1(2010):31-37. |
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