中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
The influence of stacking fault energy on the mechanical properties of nanostructured Cu and Cu-Al alloys processed by high-pressure torsion

文献类型:期刊论文

作者X. H. An ; Q. Y. Lin ; S. D. Wu ; Z. F. Zhang ; R. B. Figueiredo ; N. Gao ; T. G. Langdon
刊名Scripta Materialia
出版日期2011
卷号64期号:10页码:954-957
关键词Cu Cu-Al alloy High-pressure torsion Nanostructures Stacking fault energy ultrafine-grained materials microstructural evolution plastic-deformation high ductility copper behavior strain strength nickel metal
ISSN号1359-6462
中文摘要Nanostructured (NS) Cu and Cu-Al alloys were processed by high-pressure torsion to systematically investigate the influence of stacking fault energy (SFE) on the mechanical properties. It is shown that the strength increases with decreasing SFE and the strength of NS materials with lower Al content is especially sensitive to the characteristics of the processing conditions. The uniform elongation generally increases with decreasing SFE, but this trend is reversed at the smallest grain size of similar to 30 nm. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
原文出处://WOS:000289330700008
公开日期2012-04-13
源URL[http://210.72.142.130/handle/321006/30234]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
X. H. An,Q. Y. Lin,S. D. Wu,et al. The influence of stacking fault energy on the mechanical properties of nanostructured Cu and Cu-Al alloys processed by high-pressure torsion[J]. Scripta Materialia,2011,64(10):954-957.
APA X. H. An.,Q. Y. Lin.,S. D. Wu.,Z. F. Zhang.,R. B. Figueiredo.,...&T. G. Langdon.(2011).The influence of stacking fault energy on the mechanical properties of nanostructured Cu and Cu-Al alloys processed by high-pressure torsion.Scripta Materialia,64(10),954-957.
MLA X. H. An,et al."The influence of stacking fault energy on the mechanical properties of nanostructured Cu and Cu-Al alloys processed by high-pressure torsion".Scripta Materialia 64.10(2011):954-957.

入库方式: OAI收割

来源:金属研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。