Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing
文献类型：期刊论文
| 作者 | X. H. An ; S. Qu ; S. D. Wu ; Z. F. Zhang |
| 刊名 | Journal of Materials Research
 |
| 出版日期 | 2011 |
| 卷号 | 26期号:3页码:407-415 |
| 关键词 | electron backscatter diffraction dynamic plastic-deformation aluminum single-crystals microstructural evolution ultrahigh-strength grain-refinement shear bands copper recrystallization ductility |
| ISSN号 | 0884-2914 |
| 中文摘要 | Effects of stacking fault energy (SFE) on the thermal stability and mechanical properties of nanostructured (NS) Cu-Al alloys during thermal annealing were investigated in this study. Compared with NS Cu-5at.% Al alloy with the higher SFE, NS Cu-8at.% Al alloy exhibits the lower critical temperatures for the initiation of recrystallization and the transition from recovery-dominated to recrystallization-dominated process, which significantly signals its low thermal stability. This may be attributed to the large microstructural heterogeneities resulting from severe plastic deformation. With increasing the annealing temperatures, both Cu-Al alloys present the similar trend of decreased strength and improved ductility. Meanwhile, the remarkable enhancement of uniform elongation is achieved when the volume fraction of Static recrystallization (SRX) grains exceeds similar to 80%. Moreover, the better strength-ductility combination was achieved in the Cu-8at.% Al alloy with lower SFE. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30237]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. H. An,S. Qu,S. D. Wu,et al. Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing[J]. Journal of Materials Research,2011,26(3):407-415. |
| APA | X. H. An,S. Qu,S. D. Wu,&Z. F. Zhang.(2011).Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing.Journal of Materials Research,26(3),407-415. |
| MLA | X. H. An,et al."Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu-Al alloys during thermal annealing".Journal of Materials Research 26.3(2011):407-415. |
入库方式： OAI收割
来源：金属研究所
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