Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating
文献类型：期刊论文
| 作者 | C. Chen ; L. Zhang ; Q. Q. Lai ; C. F. Li ; J. K. Shang |
| 刊名 | Journal of Materials Science-Materials in Electronics
 |
| 出版日期 | 2011 |
| 卷号 | 22期号:9页码:1234-1238 |
| 关键词 | thin-films sn-ag alloy cu systems fe-42ni copper ni intermetallics solderability |
| ISSN号 | 0957-4522 |
| 中文摘要 | Solder wettability of Sn/FeNi plated on copper coupon after various aging conditions was tested by the wetting balance method to investigate the influence of interfacial intermetallic compound (I-IMC) growth on the solderability of tinned FeNi plating. The wetting force was found to decrease slightly with the growth of a primary FeSn(2) layer at the Sn/FeNi interface. Subsequent growth of a CuNiSn compound layer over FeSn(2) improved wettability, resulting in an increase of the wetting force by 0.035 +/- A 0.005 N/m. The results indicated that the evolution of the solder wettability was related to different I-IMCs sequentially formed at the Sn/FeNi interface. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30250]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. Chen,L. Zhang,Q. Q. Lai,et al. Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating[J]. Journal of Materials Science-Materials in Electronics,2011,22(9):1234-1238. |
| APA | C. Chen,L. Zhang,Q. Q. Lai,C. F. Li,&J. K. Shang.(2011).Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating.Journal of Materials Science-Materials in Electronics,22(9),1234-1238. |
| MLA | C. Chen,et al."Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating".Journal of Materials Science-Materials in Electronics 22.9(2011):1234-1238. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。