Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy
文献类型：期刊论文
| 作者 | X. H. Chen ; J. J. Mao |
| 刊名 | Journal of Materials Engineering and Performance
 |
| 出版日期 | 2011 |
| 卷号 | 20期号:3页码:481-486 |
| 关键词 | grain growth nanocrystalline Cu-Bi segregation strength thermal stability nanocrystalline copper segregation ni |
| ISSN号 | 1059-9495 |
| 中文摘要 | By means of pulse electrodeposition technique, a nanocrystalline Cu-0.42at.%Bi alloy with a grain size down to similar to 10 nm was synthesized. The thermal stability of Cu-Bi electrodeposit was investigated using differential scanning calorimetry (DSC), x-ray diffraction (XRD), transmission electron microscopy (TEM), and hardness measurements. The temperature at which this material tends to become unstable was found to be 160 A degrees C. DSC revealed an exothermal peak between 190 and 300 A degrees C, caused by grain growth. It was observed that segregation of Bi at grain boundary has a considerable effect on the thermal stability of the Cu-Bi alloy. Tensile test showed the sample interestingly possesses a high strength of 760 MPa, while no plastic strain is detected. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30265]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. H. Chen,J. J. Mao. Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy[J]. Journal of Materials Engineering and Performance,2011,20(3):481-486. |
| APA | X. H. Chen,&J. J. Mao.(2011).Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy.Journal of Materials Engineering and Performance,20(3),481-486. |
| MLA | X. H. Chen,et al."Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy".Journal of Materials Engineering and Performance 20.3(2011):481-486. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。