A novel electrodeposited Cu-Zn-Bi film with increased corrosion resistance in a 0.05 M K(2)SO(4) solution
文献类型：期刊论文
| 作者 | Y. Guan ; X. Peng |
| 刊名 | Applied Surface Science
 |
| 出版日期 | 2011 |
| 卷号 | 258期号:2页码:822-826 |
| 关键词 | Bi Brass Electrodeposition Crack Corrosion copper-zinc alloys coating deterioration computer-simulations unleaded brasses stacking-faults electrolytes temperature bismuth eis |
| ISSN号 | 0169-4332 |
| 中文摘要 | A single phase Cu-Zn-Bi film is fabricated on the steel wire by electrodeposition. Bi addition (similar to 1 wt.%) greatly increases the corrosion resistance of brass (Cu-36 wt.% Zn) film in a 0.05 M K(2)SO(4) solution as shown by potentiodynamic polarization and electrochemical impendence spectroscopy (EIS) experiments. It is proposed that the main reason for the improvement in the corrosion resistance by the Bi addition is that it greatly increased the crack resistance, which thus prevents crack-induced galvanic corrosion occurring between the brass film and the steel substrate. (C) 2011 Elsevier B. V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30361]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. Guan,X. Peng. A novel electrodeposited Cu-Zn-Bi film with increased corrosion resistance in a 0.05 M K(2)SO(4) solution[J]. Applied Surface Science,2011,258(2):822-826. |
| APA | Y. Guan,&X. Peng.(2011).A novel electrodeposited Cu-Zn-Bi film with increased corrosion resistance in a 0.05 M K(2)SO(4) solution.Applied Surface Science,258(2),822-826. |
| MLA | Y. Guan,et al."A novel electrodeposited Cu-Zn-Bi film with increased corrosion resistance in a 0.05 M K(2)SO(4) solution".Applied Surface Science 258.2(2011):822-826. |
入库方式： OAI收割
来源：金属研究所
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