Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current
文献类型：期刊论文
| 作者 | H. Y. Liu ; Q. S. Zhu ; Z. G. Wang ; J. K. Shang |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2011 |
| 卷号 | 528期号:3页码:1467-1471 |
| 关键词 | Electromigration Groove Stress relaxation Grain boundary diffusion tin single crystals creep-behavior solder joints electromigration ag microstructure deformation |
| ISSN号 | 0921-5093 |
| 中文摘要 | The effect of electromigration on stress relaxation behavior of pure tin solder joints was investigated. It was found that the stress relaxation rate was accelerated significantly after the sample was subjected to current stressing. The accelerating effect increased with the current stressing time. Measurements of the activation energy and stress exponent suggested that the dominant mechanism of the stress relaxation of pure tin solder joint went from dislocation climb to grain boundary diffusion after electromigration. As a result of grain boundary diffusion and sliding, grain boundary grooves were observed on the surface of the tin solder joints after electromigration. The groove was associated with the divergence of vacancy concentration at the grain boundaries. The vacancy concentration at the grain boundaries, which increased with the current stressing time, promoted the atomic diffusion along the grain boundaries, resulting in a higher stress relaxation rate. (C) 2010 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/30531]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. Y. Liu,Q. S. Zhu,Z. G. Wang,et al. Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2011,528(3):1467-1471. |
| APA | H. Y. Liu,Q. S. Zhu,Z. G. Wang,&J. K. Shang.(2011).Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,528(3),1467-1471. |
| MLA | H. Y. Liu,et al."Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 528.3(2011):1467-1471. |
入库方式： OAI收割
来源：金属研究所
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